Tapes for Semiconductor
We supply special tapes for various chips to meet the customer's needs.
Our partners manufacture tapes for Back-Grinding, Wafer Dicing, Epoxy Molding, and PKG Dicing in back-end process of LED & Semiconductor.
We supply special tapes for various chips to meet the customer's needs.
Our partners manufacture tapes for Back-Grinding, Wafer Dicing, Epoxy Molding, and PKG Dicing in back-end process of LED & Semiconductor.
• Dicing & Grinding
• Prevent chip flying during dicing due to the excellent adhesion
• Easily removed after UV irradiation
• Back Grinding
• Wafer surface protection during grinding
• Film Assist Molding
• Easily removed due the low adhesion
• Prevent resin bleed, mold flash
• Film Assist Molding
• Prevent resin bleed, mold flash
• Silicone & Thermoplastic adhesive available
| Film Type | Thickness
(㎛) | Single/
Double sided | Peel
Strength(A) | Peel
Strength(B) | Application |
|---|---|---|---|---|---|
| PO | 170 | Single | 1500gf/in | 20gf/in | UV Dicing Tape |
| PO | 170 | Single | 90gf/in | - | Wafer Back Grinding Tape |
| PO | 140 | Single | 1600gf/in | 95gf/in | PKG UV Dicing Tape |
| PET | 48 | Double | 4gf/in | - | Mold Release Tape |
| PET | 42 | Single | 12gf/in | - | Mold Release Tape |
| PU | 113 | Single | 60gf/in | - | LED Transfer Tape |
